V23833-G2005-A101 Datasheet, PDF (10/27 Pages) Infineon Technologies AG – XPAK 850 nm Module 10 Gigabit Pluggable Transceiver Compatible with XPAK MSA Rev. 2.3

V23833-Gx005-A1x1
DOM Parameters
Parameter
Transceiver Temperature Monitor
Accuracy¹⁾
Transmit Bias Current Monitor Accuracy²⁾
Transmit Power Monitor Accuracy³⁾
Receive Power Monitor Accuracy³⁾
1) _{0 to 70°C case temperature.}
2) _{0 to 12.5 mA.}
3) _{0 to 6.5 mW.}
min.
Description
Values
Unit
typ.
max.
±5
°C
±10
%
±3
dB
±3
dB
Regulatory Compliance
Feature
Standard
ESD:
Electrostatic Discharge
to the Electrical Pins
(HBM)
EIA/JESD22-A114-B
(MIL-STD 883D
Method 3015.7)
Immunity:
Against Electrostatic
Discharge (ESD) to the
Module Receptacle
EN 61000-4-2
IEC 61000-4-2
Immunity:
Against Radio
Frequency
Electromagnetic Field
EN 61000-4-3
IEC 61000-4-3
Emission:
Electromagnetic
Interference (EMI)
FCC 47 CFR
Part 15, Class B
EN 55022 Class B
CISPR 22
Comments
Class 1a (> 500 V)
Discharges ranging from ±2 kV to
±15 kV to the front end / faceplate /
receptacle cause no damage to
module (under recommended
conditions).
With a field strength of 10 V/m,
noise frequency ranges from
10 MHz to 2 GHz. No effect on
module performance between the
specification limits.
Noise frequency range:
30 MHz to 40 GHz
Radiated emission does not exceed
specified limits when measured
inside a shielding enclosure with
MSA conform cutout.
Preliminary Product Information
10
2004-05-13