TLE4275V33_15 Datasheet, PDF (10/12 Pages) Infineon Technologies AG – Stable with ceramic output capacitor

4
Package Outlines
TLE 4275 V33
Package Outlines
6.5
+0.15
-0.05
A
5.7 MAX.¹⁾
(5)
2.3
+0.05
-0.10
B
0.5
+0.08
-0.04
0.9
+0.20
-0.01
0...0.15
0.15 MAX.
per side
4.56
5 x 0.6 ±0.1
1.14
0.25 M A B
0.5
+0.08
-0.04
0.1 B
1) Includes mold flashes on each side.
All metal surfaces tin plated, except area of cut.
<gpt09527>
Footprint (Reflow Soldering)
10.6
6.4
2.2
<hlg09226>
Dimensions in mm
Figure 6 PG-TO252-5-11 Package Outline and Footprint
10 ±0.2
0...0.3
A
8.5 ¹⁾
4.4
1.27 ±0.1
B
0.05
2.4
0.1
Footprint (Reflow Soldering)
10.8
5 x 0.8 ±0.1
0...0.15
4 x 1.7
0.25 M A B
0.5 ±0.1
8˚ MAX.
0.1 B
1) Typical
Metal surface min. X = 7.25, Y = 6.9
All metal surfaces tin plated, except area of cut.
GPT09113
Figure 7 PG-TO263-5-1 Package Outline and Footprint
<hlg09441>
0.6
1.1
7.9
Dimensions in mm
Green Product (RoHS compliant)
To meet the world-wide customer requirements for environmentally friendly products and to be compliant with
government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pb-
free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).
Find more package information on the Infineon Internet Page: http://www.infineon.com/packages.
Datasheet
10
Rev. 1.1, 2015-01-15