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IRF7805PBF-1 Datasheet, PDF (1/6 Pages) Infineon Technologies AG – HEXFET® Chip-Set for DC-DC Converters
VDSS
RDS(on)
(@ VGS =4.5V)
Qg (typical)
ID
(@ TA = 25°C
30
V
11
m
22
nC
13
A
IRF7805TRPbF-1
HEXFET® Chip-Set for DC-DC Converters
S
1
S
2
S
3
G
4
AA
8
D
7
D
6
D
5
D
Top View
SO-8
IRF7805PbF
Features
Industry-standard pinout SO-8 Package
Compatible with Existing Surface Mount Techniques
RoHS Compliant, Halogen-Free
MSL1, Industrial qualification
Benefits
 Multi-Vendor Compatibility
Easier Manufacturing
Environmentally Friendlier
Increased Reliability
Base part number Package Type
IRF7805PbF-1
SO-8
Standard Pack
Form
Quantity
Tape and Reel
4000
Orderable Part Number
IRF7805TRPbF-1
Symbol
VDS
VGS
ID @ TA = 25°C
ID @ TA = 70°C
IDM
PD @TA = 25°C
PD @TA = 70°C
TJ
TSTG
Parameter
Drain-Source Voltage
Gate-to-Source Voltage
Continuous Drain Current, VGS @ 10V 
Continuous Drain Current, VGS @ 10V 
Pulsed Drain Current 
Maximum Power Dissipation 
Maximum Power Dissipation 
Linear Derating Factor
Operating Junction and
Storage Temperature Range
Thermal Resistance
Symbol
Parameter
RJL
Junction-to-Drain Lead
RJA
Junction-to-Ambient 
Max.
30
± 12
13
10
100
2.5
1.6
0.02
-55 to + 150
Units
V
A
W
W/°C
°C
Typ.
–––
–––
Max.
20
50
Units
°C/W
1
2016-08-23