ICS91305I Datasheet, PDF (6/9 Pages) Integrated Circuit Solution Inc – High Performance Communication Buffer

ICS91305I
HIGH PERFORMANCE COMMUNICATION BUFFER
Package Outline and Package Dimensions (8-pin SOIC, 150 Mil. Body)
Package dimensions are kept current with JEDEC Publication No. 95
8
INDEX
AREA
12
D
EH
Symbol
A
A1
B
C
D
E
e
H
h
L
α
Millimeters
Min
Max
1.35 1.75
0.10 0.25
0.33 0.51
0.19 0.25
4.80 5.00
3.80 4.00
1.27 BASIC
5.80 6.20
0.25 0.50
0.40 1.27
0°
8°
Inches
Min
Max
.0532 .0688
.0040 .0098
.013 .020
.0075 .0098
.1890 .1968
.1497 .1574
0.050 BASIC
.2284 .2440
.010 .020
.016 .050
0°
8°
A
h x 45
A1
-C-
e
B
SEATING
PLANE
C ^{.10 (.004)}
C
L
IDT® HIGH PERFORMANCE COMMUNICATION BUFFER
6
ICS91305I
REV G 090612