ICS524 Datasheet, PDF (5/7 Pages) Integrated Device Technology – LOW SKEW 1 TO 4 CLOCK BUFFER

ICS524
LOW SKEW 1 TO 4 CLOCK BUFFER
FAN OUT BUFFER
AC Electrical Characteristics
VDD = 2.5 V ±5%, Ambient Temperature -40 to +85°C, unless stated otherwise
Parameter
Symbol
Conditions
Min. Typ. Max. Units
Input Frequency
0
200 MHz
Output Rise Time
Output Fall Time
Propagation Delay
t_OR 0.8 to 2.0 V, C_L=15 pF
1.0 1.5 ns
t_OF 2.0 to 0.8 V, C_L=15 pF
1.0 1.5 ns
Note 1
2.2
3
5
ns
Output to Output Skew
Note 2 Rising edges at VDD/2
0
50
ps
Device to Device Skew
Rising edges at VDD/2
500 ps
VDD = 3.3 V ±5%, Ambient Temperature -40 to +85°C, unless stated otherwise
Parameter
Symbol
Conditions
Min. Typ. Max. Units
Input Frequency
0
200 MHz
Output Rise Time
Output Fall Time
Propagation Delay
t_OR 0.8 to 2.0 V, C_L=15 pF
0.6 1.0 ns
t_OF 2.0 to 0.8 V, C_L=15 pF
0.6 1.0 ns
Note 1
2.0
2.4
4
ns
Output to Output Skew
Note 2 Rising edges at VDD/2
0
50
ps
Device to Device Skew
Rising edges at VDD/2
500 ps
VDD = 5 V ±5%, Ambient Temperature -40 to +85°C, unless stated otherwise
Parameter
Symbol
Conditions
Min. Typ. Max. Units
Input Frequency
0
200 MHz
Output Rise Time
Output Fall Time
Propagation Delay
t_OR 0.8 to 2.0 V, C_L=15 pF
0.3 0.7 ns
t_OF 2.0 to 0.8 V, C_L=15 pF
0.3 0.7 ns
Note 1
1.8
2.5
4
ns
Output to Output Skew
Note 2 Rising edges at VDD/2
0
50
ps
Device to Device Skew
Rising edges at VDD/2
500 ps
Notes: 1. With rail to rail input clock
2. Between any 2 outputs with equal loading.
3. Duty cycle on outputs will match incoming clock duty cycle. Consult ICS for tight duty cycle clock
generators.
Thermal Characteristics
Parameter
Symbol Conditions
Thermal Resistance Junction to
Ambient
θ_JA Still air
θ_JA 1 m/s air flow
θ_JA 3 m/s air flow
Thermal Resistance Junction to Case θ_JC
Min.
Typ.
150
140
120
40
Max.
Units
°C/W
°C/W
°C/W
°C/W
IDT™ / ICS™ LOW SKEW 1 TO 4 CLOCK BUFFER
5
ICS524
REV A 101705