ZSSC3026 Datasheet, PDF (46/51 Pages) List of Unclassifed Manufacturers – Low Power, High Resolution 16-Bit Sensor Signal Conditioner

ZSSC3026
Table 4.1 Die Pad Assignments
Name
Direction
VDD1
IN
VDD2
Type
Supply
VSS
VSSB
VDDB
INP
INN
EOC1
EOC2
IN
OUT
OUT
IN
IN
OUT
Supply
Analog
Analog
Analog
Analog
Digital
SEL
SCLK/SCL
MOSI/SDA
MISO
SS
ZMDI-test
IN
IN
IN/Out
OUT
IN
-
Digital
Digital
Digital
Digital
Digital
-
Description
ZSSC3026 positive supply voltage for the IC, regular bond pad
ZSSC3026 positive supply voltage for the IC, special pad
(electrically connected to VDD1, also bondable)
Ground reference voltage signal
Negative bridge supply (bridge sensor ground)
Positive bridge supply
Positive bridge signal
Negative bridge signal
End of conversion, regular bond pad
End of conversion, special pad (electrically connected to
EOC1, also bondable)
I²C™ or SPI interface select
Clock input for I²C™/SPI
Data input for SPI; data in/out for I²C™
Data output for SPI
Slave select for SPI
Do not connect to these pads
© 2016 Integrated Device Technology, Inc.
46
March 28, 2016