ZSSC3026 Datasheet, PDF (1/51 Pages) List of Unclassifed Manufacturers – Low Power, High Resolution 16-Bit Sensor Signal Conditioner

Low Power, High Resolution 16-Bit
Sensor Signal Conditioner
ZSSC3026
Datasheet
Brief Description
The ZSSC3026 is a sensor signal conditioner (SSC)
integrated circuit for high-accuracy amplification and
analog-to-digital conversion of a differential input
signal. Developed for correction of resistive bridge
sensors and optimized for high-resolution altimeter
module applications, the ZSSC3026 can perform
offset, span, and 1^st and 2^nd order temperature com-
pensation of the measured signal. It can also provide
a corrected temperature output measured with an
internal sensor. The corrected measurement values
are provided at the digital output pins, which can be
configured as I²C™* (≤3.4MHz) or SPI (≤ 20MHz).
Digital compensation of the signal offset, sensitivity,
temperature, and non-linearity is accomplished via
an 18-bit internal digital signal processor (DSP) run-
ning a correction algorithm. Calibration coefficients
are stored on-chip in a highly reliable, non-volatile,
multiple-time programmable (MTP) memory. Prog-
ramming the ZSSC3026 is simple via the serial
interface. An internal charge pump provides the
programming voltage. The interface is used for the
PC-controlled calibration procedure, which programs
the calibration coefficients in memory. The digital
mating is fast and precise, eliminating the overhead
normally associated with trimming external com-
ponents and multi-pass calibration routines.
Features
• Flexible, programmable analog front-end design;
up to 16-bit scalable, charge-balancing two-
segment analog-to-digital converter (ADC)
• Fully programmable gain amplifier for optimizing
sensor signals: gain range 14 to 72 (linear)
• Internal auto-compensated temperature sensor
• Digital compensation of individual sensor offset;
1^st and 2^nd order compensation of sensor gain
• Digital compensation of 1^st and 2^nd order tem-
perature gain and offset drift
• Intelligent power management unit
• Layout customized for die-die bonding with
sensor for high-density chip-on-board assembly
• Typical sensor elements can achieve accuracy of
better than ±0.10% FSO @ -40 to 85°C
* I²C™ is a registered trademark of NXP.
Benefits
• Excellent for low-voltage and low-power battery
applications
• Integrated 18-bit calibration math DSP
• Costs minimized via one-pass calibration
• No external trimming components required
• Highly integrated CMOS design
Physical Characteristics
• Supply voltage range: 1.8 to 3.6V
• Current consumption: 900µA (operating mode)
• Sleep State current: 50nA (typical)
• Temperature resolution: <0.003K/LSB
• Operation temperatures depending on part
number: –40°C to +85°C
• Small die size
• Delivery options: die for wafer bonding, bumped
die for Flip Chip, PQFN24
Typical Applications
The ZSSC3026 is designed for operation in cali-
brated resistive (e.g., pressure) sensor modules:
• Barometric altitude measurement for portable
navigation
• Altitude measurement for emergency call
systems and car navigation
• Inside hard disk pressure measurement
• Weather forecast
• Fan control
ZSSC3026 Application Example
© 2016 Integrated Device Technology, Inc.
1
March 28, 2016