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ADC1112D125 Datasheet, PDF (36/39 Pages) NXP Semiconductors – Dual 11-bit ADC; CMOS or LVDS DDR digital outputs
Integrated Device Technology
12. Package outline
ADC1112D125
Dual 11-bit ADC: CMOS or LVDS DDR digital outputs
HVQFN64: plastic thermal enhanced very thin quad flat package; no leads;
64 terminals; body 9 x 9 x 0.85 mm
SOT804-3
D
terminal 1
index area
BA
E
A A1
c
detail X
L
17
16
e1
1/2 e
e
b
v
w
32
33
CAB
C
y1 C
C
y
e
Eh
e2
1/2 e
1
48
terminal 1 64
49
index area
Dh
X
Dimensions
0
2.5
5 mm
scale
Unit
A A1 b
c D(1) Dh E(1) Eh e e1 e2 L
v
w
y y1
max 1.00 0.05 0.30
9.1 7.25 9.1 7.25
0.5
mm nom 0.85 0.02 0.21 0.2 9.0 7.10 9.0 7.10 0.5 7.5 7.5 0.4 0.1 0.05 0.05 0.1
min 0.80 0.00 0.18
8.9 6.95 8.9 6.95
0.3
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
Outline
version
References
IEC
JEDEC
JEITA
European
projection
SOT804-3
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Fig 35. Package outline SOT804-3 (HVQFN64)
ADC1112D125 3
Product data sheet
Rev. 03 — 2 July 2012
sot804-3_po
Issue date
09-02-24
10-08-06
© IDT 2012. All rights reserved.
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