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TSE2004GB2C0 Datasheet, PDF (30/38 Pages) Integrated Device Technology – DDR4 Temperature Sensor with Integrated 4Kbit EEPROM for Memory Module
TSE2004GB2C0 Datasheet
DC Characteristics
Table 25. DC Characteristics
f <400kHz
f >400kHz
Symbol
Parameter
Conditions
ILI Input
SCL, SDA VIN = VSSSPD or VDDSPD
Leakage Current
ILO Output Leakage Current
IDD Supply Current
VOUT = VSSSPD or
VDDSPD, SDA in Hi-Z
VDDSPD = 3.3V, fC =
100kHz (rise/fall time
Minimum
—
—
—
Maximum
±5
±5
2
Minimum
—
—
—
Maximum Units
±5
µA
±5
µA
2
mA
VIN = VSSSPD or
—
100
—
100
µA
IDD1 Standby Supply Current
VDDSPD, VDDSPD = 3.6V
VIN = VSSSPD or
—
100
—
100
µA
VDDSPD, VDDSPD = 2.2V
VIL Input
Low Voltage
SCL, SDA —
-0.5
0.3 ×
-0.5
0.3 ×
V
VDDSPD
VDDSPD
VIH Input
High Voltage
SCL, SDA —
0.7V ×
VDDSPD
0.7V ×
VDDSPD
V
VDDSPD
+0.5
VDDSPD
+0.5V
VHV SA0 High Voltage
VHV – VDDSPD >4.8V
7
10
7
10
V
VOL1 Output Low Voltage
3mA sink current,
Open-drain or Open-collector VDDSPD >2V
—
0.4
—
0.4
V
IOL
LOW-level Output Current[a]
VOL = 0.4V
VOL = 0.6V
3
6
20
mA
—
—
mA
VHYST Input Hysteresis
VDDSPD >2V
0.05V ×
—
0.0 ×
—
V
VDDSPD
VDDSPD
VPON Power-on Reset Threshold
Monotonic rise between
1.6
—
1.6
—
V
VPON and VDDSPD
VPOFF Power Off Threshold for
warm power-on cycle
No ring-back above
VPOFF
—
0.9
—
0.9
V
[a] In order to drive a full bus load at 400kHz, 6mA IOL is required at 0.6V VOL. Parts not meeting this specification can still function, but not at 400kHz and
400pF.
©2017 Integrated Device Technology, Inc.
30
May 15, 2017