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ZSSC3224 Datasheet, PDF (1/51 Pages) Integrated Device Technology – High End 24-Bit Sensor Signal Conditioner IC
High End 24-Bit Sensor Signal
Conditioner IC
ZSSC3224
Datasheet
Brief Description
The ZSSC3224 is a sensor signal conditioner (SSC) IC
for high-accuracy amplification and analog-to-digital con-
version of a differential or pseudo-differential input
signal. Designed for high-resolution sensor module
applications, the ZSSC3224 can perform offset, span,
and 1st and 2nd order temperature compensation of the
measured signal. Developed for correction of resistive
bridge or absolute voltage sensors, it can also provide a
corrected temperature output measured with an internal
sensor.
The measured and corrected sensor values are provided
at the digital output pins, which can be configured as I2C
(≤ 3.4MHz) or SPI (≤ 20MHz). Digital compensation of
signal offset, sensitivity, temperature, and non-linearity is
accomplished via a 26-bit internal digital signal
processor (DSP) running a correction algorithm.
Calibration coefficients are stored on-chip in a highly
reliable, non-volatile, multiple-time programmable (MTP)
memory. Programming the ZSSC3224 is simple via the
serial interface. The interface is used for the PC-
controlled calibration procedure, which programs the set
of calibration coefficients in memory. The ZSSC3224
provides accelerated signal processing, increased
resolution, and improved noise immunity in order to
support high-speed control, safety, and real-time sensing
applications with the highest requirements for energy
efficiency.
Features
 Flexible, programmable analog front-end design; up
to 24-bit analog-to-digital converter (ADC)
 Fully programmable gain amplifier for optimizing
sensor signals: gain range 6.6 to 216 (linear)
 Internal auto-compensated 18-bit temperature sensor
 Digital compensation of individual sensor offset; 1st
and 2nd order digital compensation of sensor gain as
well as 1st and 2nd order temperature gain and offset
drift
 Programmable interrupt operation
 High-speed sensing: e.g., 18-bit conditioned sensor
signal measurement rate >200s-1
 Typical sensor elements can achieve an accuracy of
better than ±0.10% FSO* at -40 to 85°C
Benefits
 Integrated 26-bit calibration math digital signal
processor (DSP)
 Fully corrected signal at digital output
 Layout customized for die-die bonding with sensor for
high-density chip-on-board assembly
 One-pass calibration minimizes calibration costs
 No external trimming, filter, or buffering components
required
 Highly integrated CMOS design
 Integrated reprogrammable non-volatile memory
 Excellent for low-voltage and low-power battery
applications
 Optimized for operation in calibrated resistive
(e.g., pressure) sensor or calibrated absolute voltage
(e.g., thermopile) sensor modules
Physical Characteristics
 Supply voltage range: 1.68V to 3.6V
 Operating mode current: ~1.0mA (typical)
 Sleep Mode current: 20nA (typical)
 Temperature resolution: <0.7mK/LSB
 Excellent energy-efficiency:
with 18-bit resolution: <100pJ/step
with 24-bit resolution: <150nJ/step
 Operation temperature: –40°C to +85°C
 Small die size
 Delivery options: die for wafer bonding
* FSO = Full Scale Output.
ZSSC3224 Application Example
VSS
RES
EOC
MISO
VDD
Stacked-Die Sensor Module
VDD
ZSSC3224
VSS
VDDB
INP(+)
SS
RES
VDDB
INN
EOC
MISO
sensor element
INN(-)
VSSB
INP
VSSB
MOSI
SDA
SCLK
SCL
VSS
VDD
Battery
SS
MOSI
SDA
SCLK
SCL
Microcontroller
© 2016 Integrated Device Technology, Inc
1
October 24, 2016