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ICS843-75 Datasheet, PDF (8/12 Pages) Integrated Circuit Systems – 75MHZ, LVCMOS, LVPECL DUAL OUTPUT OSCILLATOR
Integrated
Circuit
Systems, Inc.
ICS843-75
75MHZ, LVCMOS, LVPECL
DUAL OUTPUT OSCILLATOR
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS843-75.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS843-75 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for VCC = 3.3V + 0.3V = 3.6V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
• Power (core) = V
*I
= 3.6V * 110mA = 396mW
MAX
CC_MAX EE_MAX
• Power (outputs)MAX = 30mW/Loaded Output pair
Total Power_MAX (3.465V, with all outputs switching) = 396mW + 30mW = 426mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of
the device. The maximum recommended junction temperature for HiPerClockSTM devices is 125°C.
The equation for Tj is as follows: Tj = θJA * Pd_total + TA
Tj = Junction Temperature
θJA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θJA must be used.
Assuming a moderate air flow of 1 meter per second and a multi-layer board, the appropriate value is 90.5°C/W per Table 6A
below.
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:
70°C + 0.426W * 90.5°C/W = 108.6°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air
flow, and the type of board (single layer or multi-layer).
TABLE 6A.THERMAL RESISTANCE θJA FOR 8-PIN TSSOP, FORCED CONVECTION
θJA by Velocity (Meters per Second)
Multi-Layer PCB, JEDEC Standard Test Boards
0
101.7°C/W
1
90.5°C/W
2.5
89.8°C/W
TABLE 6B. THERMAL RESISTANCE θJA FOR 8 LEAD SOIC FORCED CONVECTION
θJA by Velocity (Linear Feet per Minute)
0
200
Single-Layer PCB, JEDEC Standard Test Boards
153.3°C/W
128.5°C/W
Multi-Layer PCB, JEDEC Standard Test Boards
112.7°C/W
103.3°C/W
500
115.5°C/W
97.1°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
843AG-75
www.icst.com/products/hiperclocks.html
REV. A JANUARY 9, 2006
8