ICS650-01 Datasheet, PDF (3/4 Pages) Integrated Circuit Systems – System Peripheral Clock Source

ICS650-01
System Peripheral Clock Source
Electrical Specifications
Parameter
Conditions
ABSOLUTE MAXIMUM RATINGS (note 1)
Minimum
Supply voltage, VDD
Referenced to GND
Inputs and Clock Outputs
Referenced to GND
-0.5
Ambient Operating Temperature
0
Soldering Temperature
Max of 10 seconds
Storage temperature
-65
DC CHARACTERISTICS (VDD = 3.3V or 5V unless noted)
Operating Voltage, VDD
3.0
Input High Voltage, VIH
Select inputs, OE
2
Input Low Voltage, VIL
Select inputs, OE
Output High Voltage, VOH
VDD=3.3V, IOH=-8mA 2.4
Output Low Voltage, VOL
VDD=3.3V, IOL=8mA
Output High Voltage, VOH, VDD = 3.3 or 5V IOH=-8mA
VDD-0.4
Operating Supply Current, IDD, at 5V
No Load, note 2
Operating Supply Current, IDD, at 3.3V
No Load, note 2
Short Circuit Current, VDD = 3.3
Each output
Input Capacitance
Except X1
AC CHARACTERISTICS (VDD = 3.3V or 5V unless noted)
Input Crystal or Clock Frequency
Output Clocks Accuracy (synthesis error)
All clocks
Output Clock Rise Time
0.8 to 2.0V
Output Clock Fall Time
2.0 to 0.8V
Output Clock Duty Cycle
At VDD/2
40
One Sigma Jitter, except ACLK
One Sigma Jitter, ACLK
Absolute Clock Period Jitter PCLK, UCLK, 20M
- 500
Typical
50
30
±50
7
14.31818
50
75
170
Maximum Units
7
V
VDD+0.5 V
70
C
260
C
150
C
5.5
V
V
0.8
V
V
0.4
V
V
mA
mA
mA
pF
MHz
1
ppm
1.5
ns
1.5
ns
60
%
ps
ps
500
ps
Notes: 1. Stresses beyond those listed under Absolute Maximum Ratings could cause permanent damage to the device. Prolonged
exposure to levels above the operating limits but below the Absolute Maximums may affect device reliability.
2. With all clocks at highest frequencies.
External Components
The ICS650 requires a minimum number of external components for proper operation. Decoupling
capacitors of 0.1µF should be connected between VDD and GND (on pins 4 and 6, and pins 16 and 14),
as close to the chip as possible. A series termination resistor of 33Ω may be used for each clock output. The
14.31818 MHz crystal must be connected as close to the chip as possible. The crystal should be a
fundamental mode, parallel resonant, 30ppm or better (to meet the Ethernet specs). Crystal capacitors
should be connected from pins X1 to ground and X2 to ground. The value of these capacitors is given by
the following equation, where C_L is the crystal load capacitance: Crystal caps (pF) = (C_L-12) x 2. So for a
crystal with 16pF load capacitance, two 8pF caps should be used. If a clock input is used, drive it into X1
and leave X2 unconnected.
MDS 650-01 C
3
Revision 092799
Printed 11/15/00
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