ICS8530I-01 Datasheet, PDF (12/17 Pages) Integrated Circuit Systems – LOW SKEW, 1-TO-16 DIFFERENTIAL-TO-3.3V LVPECL FANOUT BUFFER

Integrated
Circuit
Systems, Inc.
PRELIMINARY
ICS8530I-01
LOW SKEW, 1-TO-16
DIFFERENTIAL-TO-3.3V LVPECL FANOUT BUFFER
THERMAL RELEASE PATH
The expose metal pad provides heat transfer from the device to
the P.C. board. The expose metal pad is ground pad connected
to ground plane through thermal via. The exposed pad on the
device to the exposed metal pad on the PCB is contacted through
solder as shown in Figure 4. For further information, please re-
fer to the Application Note on Surface Mount Assembly of
Amkor’s Thermally /Electrically Enhance Leadframe Base Pack-
age, Amkor Technology.
SOLDER M ASK
SIGNAL
TRACE
EXPOSED PAD
SOLDER
SIGNAL
TRACE
GROUND PLANE
THERMAL VIA
Expose Metal Pad
(GROUND PAD)
FIGURE 4. P.C. BOARD FOR EXPOSED PAD THERMAL RELEASE PATH EXAMPLE
8530DYI-01
www.icst.com/products/hiperclocks.html
12
REV. A FEBRUARY 25, 2005