IC-DL_17 Datasheet, PDF (8/10 Pages) IC-Haus GmbH – 3-CHANNEL DIFFERENTIAL LINE DRIVER

iC-DL
3-CHANNEL DIFFERENTIAL LINE DRIVER
Rev C1, Page 8/10
PRINTED CIRCUIT BOARD LAYOUT
The thermal pad at the bottom of the package improves
thermal dissipation. The board layout has to be de-
signed so that an appropriate number of copper vias
below the thermal pad area form a good conductive
path to the reverse of the board where a blank copper
surface of sufficient size (approx. 2 cm²) carries off heat.
The thermal pad is to be soldered to the board and
must be connected to GND.
To smooth the local IC supply VCC and VBx, blocking
capacitors must be connected directly to these pins and
to GND.
EVALUATION BOARD
iC-DL is in a QFN28 package and comes with a eval-
uation board for test purposes. Figures 5 and 6 show
both the wiring and the top of the evaluation board.
Figure 5: Circuit diagram of the evaluation board