IC-LSHB_17 Datasheet, PDF (5/9 Pages) IC-Haus GmbH – INCREMENTAL PHOTOSENSOR ARRAY

iC-LSHB
INCREMENTAL PHOTOSENSOR ARRAY
Rev D1, Page 5/9
ABSOLUTE MAXIMUM RATINGS
These ratings do not imply operating conditions; functional operation is not guaranteed. Beyond these ratings device damage may occur.
Item Symbol Parameter
No.
Conditions
Min.
Unit
Max.
G001 VCC
Voltage at VCC
-0.3
6
V
G002 I(VCC) Current in VCC
-20
20
mA
G003 V()
Pin Voltage, all signal outputs
-0.3 VCC + 0.3 V
G004 I()
Pin Current, all signal outputs
-20
20
mA
G005 Vd()
ESD Susceptibility, all pins
HBM, 100 pF discharged through 1.5 kΩ
2
kV
G006 Tj
Junction Temperature
-40
150
°C
G007 Ts
Chip Storage Temperature
-40
150
°C
THERMAL DATA
Operating conditions: VCC = 4.1 V . . . 5.5 V
Item Symbol Parameter
No.
Conditions
T01 Ta
Operating Ambient Temperature Range package oQFN32-5x5
package oBGA LSH2C
T02 Ts
Storage Temperature Range
package oQFN32-5x5
package oBGA LSH2C
T03 Tpk
Soldering Peak Temperature
package oQFN32-5x5;
Unit
Min. Typ. Max.
-40
125 °C
-40
110 °C
-40
125 °C
-40
110 °C
tpk < 20 s, convection reflow
tpk < 20 s, vapor phase soldering
245 °C
230 °C
T04 Tpk
Soldering Peak Temperature
MSL 5A (max. floor life 24 h at 30 °C and 60 %
RH);
Please refer to customer information file No. 7
for details.
package oBGA LSH2C
tpk < 20 s, convection reflow
tpk < 20 s, vapor phase soldering
245 °C
230 °C
TOL (time on label) 8 h;
Please refer to customer information file No. 7
for details.
All voltages are referenced to ground unless otherwise stated.
All currents flowing into the device pins are positive; all currents flowing out of the device pins are negative.