IC-LSHB_17 Datasheet, PDF (4/9 Pages) IC-Haus GmbH – INCREMENTAL PHOTOSENSOR ARRAY

iC-LSHB
INCREMENTAL PHOTOSENSOR ARRAY
Rev D1, Page 4/9
PACKAGE DIMENSIONS oQFN32-5x5
RECOMMENDED PCB-FOOTPRINT
4.90
3.60
R0.15
SIDE
0.50
0.30
TOP
BOTTOM
5
3.60
1.90
0.50
0.23
All dimensions given in mm. Tolerances of form and position according to JEDEC MO-220.
Positional tolerance of sensor pattern: ±70μm / ±1° (with respect to backside pad).
G4: radius of chip center (refer to the relevant encoder disc and code description).
Maximum molding excess +20μm / -75μm versus surface of glass/reticle.
drb_lshb-oqfn32-2_pack_1, 10:1