IC-HG_11 Datasheet, PDF (3/21 Pages) IC-Haus GmbH – 3 A LASER SWITCH

iC-HG
3 A LASER SWITCH
PACKAGES QFN28 5 mm x 5 mm to JEDEC
preliminary
Rev A2, Page 3/21
PIN CONFIGURATION QFN28 5 mm x 5 mm
28 27 26 25 24 23 22
1
21
2
20
3
19
4
HG
18
5
code...
17
6
...
16
7
15
8 9 10 11 12 13 14
PIN FUNCTIONS
No. Name Function
1 CI1 Current control voltage channel 1
2 CI2 Current control voltage channel 2
3 CI3 Current control voltage channel 3
4 GND Ground
5 CI4 Current control voltage channel 4
6 CI5 Current control voltage channel 5
7 CI6 Current control voltage channel 6
8 AGND6 Analog ground channel 6
9 LDK6 Laser diode cathode channel 6
10 AGND5 Analog ground channel 5
11 LDK5 Laser diode cathode channel 5
12 AGND4 Analog ground channel 4
13 LDK4 Laser diode cathode channel 4
14 EN6 TTL switching input channel 6
Negative LVDS Input channel 5 and 6
15 EN5 TTL switching input channel 5
Positive LVDS Input channel 5 and 6
16 EN4 TTL switching input channel 4
Negative LVDS Input channel 3 and 4
17 EN3 TTL switching input channel 3
Positive LVDS Input channel 3 and 4
18 VDD Supply voltage
19 ELVDS TTL/LVDS Fast/Slow Input selector
20 EN2 TTL switching input channel 2
Negative LVDS Input channel 1 and 2
21 EN1 TTL switching input channel 1
Positive LVDS Input channel 1 and 2
22 NER Error monitor output
23 LDK3 Laser diode cathode channel 3
24 AGND3 Analog ground channel 3
25 LDK2 Laser diode cathode channel 2
26 AGND2 Analog ground channel 2
27 LDK1 Laser diode cathode channel 1
28 AGND1 Analog ground channel 1
The Thermal Pad is to be connected to a Ground Plane (GND, AGND1. . . 6) on the PCB.
Only pin 1 marking on top or bottom defines the package orientation ( HG label and coding is subject
to change).