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HY5PS2G431MP Datasheet, PDF (14/35 Pages) Hynix Semiconductor – 2Gb DDR2 SDRAM(DDP)
1HY5PS2G431M[P]
1HY5PS2G831M[P]
3.3 Output Buffer Characteristics
3.3.1 Output AC Test Conditions
Symbol
VOTR
Parameter
Output Timing Measurement Reference Level
1. The VDDQ of the device under test is referenced.
SSTL_18 Class II
0.5 * VDDQ
Units
V
Notes
1
3.3.2 Output DC Current Drive
Symbol
Parameter
SSTl_18
Units
Notes
IOH(dc) Output Minimum Source DC Current
- 13.4
mA
1, 3, 4
IOL(dc)
Output Minimum Sink DC Current
13.4
mA
2, 3, 4
1. VDDQ = 1.7 V; VOUT = 1420 mV. (VOUT - VDDQ)/IOH must be less than 21 ohm for values of VOUT between VDDQ and VDDQ -
280 mV.
2. VDDQ = 1.7 V; VOUT = 280 mV. VOUT/IOL must be less than 21 ohm for values of VOUT between 0 V and 280 mV.
3. The dc value of VREF applied to the receiving device is set to VTT
4. The values of IOH(dc) and IOL(dc) are based on the conditions given in Notes 1 and 2. They are used to test device drive
current capability to ensure VIH min plus a noise margin and VIL max minus a noise margin are delivered to an SSTL_18
receiver. The actual current values are derived by shifting the desired driver operating point (see Section 3.3) along a 21 ohm
load line to define a convenient driver current for measurement.
3.3.3 OCD defalut characteristics
Description
Output impedance
Output impedance step size for OCD calibra-
tion
Pull-up and pull-down mismatch
Output slew rate
Parameter
Sout
Min
-
0
0
1.5
Nom
-
-
Max
-
1.5
4
5
Unit
ohms
Notes
1
ohms
6
ohms
V/ns
1,2,3
1,4,5,6,7,8
Note
1. Absolute Specifications ( Toper; VDD = +1.8V ±0.1V, VDDQ = +1.8V ±0.1V)
2. Impedance measurement condition for output source dc current: VDDQ=1.7V; VOUT=1420mV; (VOUT-VDDQ)/Ioh must be
less than 23.4 ohms for values of VOUT between VDDQ and VDDQ-280mV. Impedance measurement condition for output sink
dc current: VDDQ = 1.7V; VOUT = 280mV; VOUT/Iol must be less than 23.4 ohms for values of VOUT between 0V and 280mV.
3. Mismatch is absolute value between pull-up and pull-dn, both are measured at same temperature and voltage.
4. Slew rate measured from vil(ac) to vih(ac).
5. The absolute value of the slew rate as measured from DC to DC is equal to or greater than the slew rate as measured from AC
to AC. This is guaranteed by design and characterization.
6. This represents the step size when the OCD is near 18 ohms at nominal conditions across all process corners/variations and
represents only the DRAM uncertainty. A 0 ohm value(no calibration) can only be achieved if the OCD impedance is 18 ohms
+/- 0.75 ohms under nominal conditions.
VTT
Output Slew rate load:
25 ohms
Output
(Vout)
Reference
point
7. DRAM output slew rate specification applies to 400 , 533 and 667 MT/s speed bins.
8. Timing skew due to DRAM output slew rate mis-match between DQS / DQS and associated DQs is included in tDQSQ and
tQHS specification.
Rev. 0.5 / Dec 2006
14