HY62SF16406C Datasheet, PDF (10/11 Pages) Hynix Semiconductor – 256Kx16bit full CMOS SRAM

HY62SF16406C Series
PACKAGE INFORMATION
48ball Micro Ball Grid Array Package(M)
BOTTOM VIEW
B
A
6 5 4 3 21
A
A
B
C
D
C
E
F
G
H
A1 CORNER
INDEX AREA
C1/2
3.0 X 5.0 MIN
FLAT AREA
TOP VIEW
C1
5
C
E
3 D(DIAMETER)
B1/2
SIDE VIEW
A
B1
E1
E2
SEATING PLANE
4
r
Symbol
Min.
A
-
B
-
B1
6.7
C
-
C1
8.3
D
0.3
E
0.85
E1
0.6
E2
0.2
R
-
Typ.
0.75
3.75
6.8
5.25
8.4
0.35
0.9
0.65
0.25
-
Max.
-
-
6.9
-
8.5
0.4
0.95
0.7
0.3
0.08
Note
1. DIMENSIONING AND TOLERANCING PER ASME Y14. 5M-1994.
2. ALL DIMENSIONS ARE MILLIMETERS.
3. DIMENSION “D” IS MEASURED AT THE MAXIMUM SOLDER
BALL DIAMETER IN A PLANE PARALLEL TO DATUM C.
4. PRIMARY DATUM C(SEATING PLANE) IS DEFINED BY THE
CROWN OF THE SOLDER BALLS.
5. THIS IS A CONTROLLING DIMENSION.
Rev.02 / Jun.01
9