H277 Datasheet, PDF (6/7 Pages) Hi-Sincerity Mocroelectronics – On-chip Hall sensor

HI-SINCERITY
MICROELECTRONICS CORP.
SIP-4L Dimension
A
I
B
J
C ^{a1 a2}
12 34
H
D
K
F
E
E
G
a2
Marking Site
a1
L
4-Lead SIP-4L
Plastic Package
HSMC Package Code: AD
Marking:
Note: Green label is used for Pb-free packing
Pin Style: 1.VCC 2.Vout1 3.Vout2 4.GND
Hall Sensor Location:
2.0 0m m
1 .2 5m m
To p
V iew
Material:
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
Spec. No. : IC200907
Issued Date : 2009.04.03
Revised Date :2009.10.29
Page No. : 6/7
DIM Min. Max.
A
5.12 5.32
B
4.10 4.30
C
3.55 3.75
D
0.43 0.49
E
0.35 0.41
F
1.24 1.30
G
3.78 3.84
H
1.32 1.52
I
1.45 1.65
J
0.93 1.13
K 13.00 15.50
L
a1
3^o
5^o
a2
5^o
7^o
*: Typical, Unit: mm
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of AVANTIC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office:
• Head Office (Hi-Sincerity Microelectronics Corp.): 5/F., Golden Harvest Building 15 Wang Chiu Road, Kowloon Bay, Hong Kong
Tel: [phone] Fax: [phone]
AVANTICS : Shanghai Address: No.399, Cai Lum Rd. Zhangjiang Technology Industrial Park Pudong, Shanghai 201210, China
Tel: [phone] Fax: [phone]
H277
HSMC Product Specification