HBCW65C Datasheet, PDF (3/3 Pages) Hi-Sincerity Mocroelectronics – NPN EPITAXIAL PLANAR TRANSISTOR

HI-SINCERITY
MICROELECTRONICS CORP.
SOT-23 Dimension
Spec. No. : HE6808
Issued Date : 1998.02.01
Revised Date : 2002.10.24
Page No. : 3/3
A
L
3
BS
1
2
V
G
C
Marking:
EC
Rank Code
Control Code
3-Lead SOT-23 Plastic
Surface Mounted Package
HSMC Package Code: N
D
H
K
J
Style: Pin 1.Base 2.Emitter 3.Collector
DIM
Inches
Min. Max.
A 0.1102 0.1204
B 0.0472 0.0630
C 0.0335 0.0512
D 0.0118 0.0197
G 0.0669 0.0910
H 0.0005 0.0040
Millimeters
Min. Max.
2.80
3.04
1.20
1.60
0.89
1.30
0.30
0.50
1.70
2.30
0.013
0.10
DIM
Inches
Min. Max.
J 0.0034 0.0070
K 0.0128 0.0266
L 0.0335 0.0453
S 0.0830 0.1083
V 0.0098 0.0256
*: Typical
Millimeters
Min. Max.
0.085 0.177
0.32
0.67
0.85
1.15
2.10
2.75
0.25
0.65
Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : [phone] Fax: [phone]
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: [phone]~5 Fax: [phone]
HBCW65C
HSMC Product Specification