H393P Datasheet, PDF (3/3 Pages) Hi-Sincerity Mocroelectronics – LOW POWER LOW OFFSET VOLTAGE COMPARATORS

HI-SINCERITY
MICROELECTRONICS CORP.
DIP-8P Dimension
Spec. No. : Preliminary Data
Issued Date : 2001.05.01
Revised Date : 2001.06.22
Page No. : 3/3
87 6 5
A
12 34
B
J
F
Marking :
H
393
P
Date Code
C
EG
α1 _K
DH
I
M
L
DIP-8P Plastic Package
HSMC Package Code : P
DIM
Inches
Min.
Max.
A 0.2480 0.2520
B 0.3630 0.3670
C
-
*0.0600
D
-
*0.0500
E
-
*0.0390
F 0.1280 0.1320
G 0.1250 0.1400
Millimeters
Min.
Max.
6.29
6.40
9.22
9.32
-
*1.52
-
*1.27
-
*0.99
3.25
3.35
3.17
3.55
*:Typical
DIM
Inches
Min.
Max.
Millimeters
Min.
Max.
H 0.0150 0.0210 0.38
0.53
I
0.0898 0.1098 2.28
2.79
J 0.2950 0.3050 7.49
7.74
K
-
*0.1181
-
*3.00
L 0.3370 0.7470 8.56
8.81
M 0.0090 0.0150 0.229 0.381
α1
94°
97°
94°
97°
Notes : 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice :
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
• Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : [phone] Fax : [phone]
• Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : [phone]~5 Fax : [phone]
H393P
HSMC Product Specification