HPMD-7904 Datasheet, PDF (7/8 Pages) Agilent(Hewlett-Packard) – FBAR Duplexer for US PCS Band

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Top View
Empty Pocket/Cavity
Leader: 100 pocket – 1 Meter
Trailer: 100 pocket – 1 Meter
Figure 15. Device Orientation.
End View
Solder Recommendations
The HPMD-7904 FBAR duplexer
(and its variants) is an assembly
consisting of two LCC ceramic
packages, containing the Tx and
Rx filters, mounted to a small
circuit board. Both packages on
the circuit board are mounted in
place using Sn96.5/Ag3.5 solder
(shaded in Table 1).
The recommended solder profile
for the FBAR duplexer is shown
in Figure 16. Guidelines and a
typical profile are both shown.
This typical profile was tested on
ten samples of the duplexer, each
of which was subjected to the
profile six times without effect
upon the mechanical or electrical
characteristics of the device.
Solder temperatures and times in
excess of those given in the
guidelines of Table 1 may result
in damage to the duplexer or
changes in its characteristics.
Table 1. Solder Compositions
Alloy type
Melting temp.
(^oC)
Sn42Bi58
Sn43Pb43Bi14
Sn63Pb37
Sn60Pb40
Sn91/Zn9
Sn96.2Ag2.5Cu0.8Sb0.5
Sn95.8Ag3.5Cu0.7
Sn96.5Ag3.5
Sn100
Sn95Sb5
Sn97Cu3
138
144 – 163
183
186
199
216
217
221
232
235
240
Recommended working
temperature (^oC)
160 – 180
165 – 185
200 – 240
200 – 240
200 – 240
235 – 255
235 – 255
240 – 260
260 – 280
260 – 280
260 – 300
Comments
Lead free
Contains lead – some customers prohibit it.
Contains lead – some customers prohibit it.
Contains lead – some customers prohibit it.
May have oxidation problems
Popular lead free composition
Other alloy ratios are available
Used in the assembly of duplexers
Too hot – will melt the duplexer
Too hot – will melt the duplexer
Too hot – will melt the duplexer
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