HCPL-0370 Datasheet, PDF (6/13 Pages) Agilent(Hewlett-Packard) – AC/DC to Logic Interface Optocouplers

6
Insulation and Safety Related Specifications
Parameter
Min.. External Air Gap
(External Clearance)
Min.. External Tracking
Path (External Creepage)
Min.. Internal Plastic
Gap (Internal Clearance)
Tracking Resistance
(Comparative
Tracking Index)
Isolation Group
Symbol
L(IO1)
L(IO2)
CTI
8-Pin DIP
(300 mil)
Value
7.1
7.4
0.08
200
SO-8
Value
4.9
4.8
0.08
200
Units
mm
mm
mm
V
Conditions
Measured from input terminals to output
sterminals, hortest distance through air
Measured from input terminals to output
terminals, shortest distance path along body
Through insulation distance, conductor to
conductor, usually the direct distance between
the photoemitter and photodetector inside the
optocoupler cavity
DIN IEC 112/VDE 0303 PART 1
IIIa
Material Group (DIN VDE 0110, 1/89, Table 1)
Absolute Maximum Ratings (No derating required up to 70°C)
Parameter
Symbol Min. Max.
Storage Temperature
Operating Temperature
Lead Soldering Cycle
Temperature
T_S
-55
125
T_A
-40
85
260
Time
Input Current
Average
Surge
I_IN
Transient
Input Voltage (Pins 2-3)
Input Power Dissipation
V_IN
HCPL-3700/3760
P_IN
HCPL-0370
Total Package Power Dissipation HCPL-3700/3760
P_T
HCPL-0370
10
50
140
500
-0.5
230
172
305
275
Output Power Dissipation
HCPL-3700/3760
P_O
210
HCPL-0370
103
Output Current
Supply Voltage (Pins 8-5)
Output Voltage (Pins 6-5)
Solder Reflow Temperature Profile
Average
I_O
30
V_CC
-0.5
20
V_O
-0.5
20
See Package Outline Drawings section
Units
°C
°C
°C
s
mA
Note
1
2
2, 3
V
mW
4
mW
5
mW
6
mA
7
V
V
Recommended Operating Conditions
Parameter
Supply Voltage
Operating Temperature
Operating Frequency
Symbol
V_CC
T_A
f
Min.
2
0
0
Max.
18
70
4
Units
V
°C
kHz
Note
8