HCPL-4504 Datasheet, PDF (5/16 Pages) Agilent(Hewlett-Packard) – High CMR, High Speed Optocouplers

8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW4504)
11.15 ± 0.15
(0.442 ± 0.006)
PAD LOCATION (FOR REFERENCE ONLY)
8
7
6
5
9.00 ± 0.15
(0.354 ± 0.006)
1
2
3
4
(06.2.1452)TYP.
12.30 ± 0.30
(0.484 ± 0.012)
1.55
(0.061)
MAX.
(04..10508)MAX.
1.3
(0.051)
0.9
(0.035)
12.30 ± 0.30
(0.484 ± 0.012)
11.00 _MAX.
(0.433)
1.78 ± 0.15
(0.070 ± 0.006)
2.54
(0.100)
BSC
0.75 ± 0.25
(0.030 ± 0.010)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
1.00 ± 0.15
(0.039 ± 0.006)
0.254
+ 0.076
- 0.0051
(0.010+-
0.003)
0.002)
7° NOM.
Solder Reflow Temperature Profile
(HCPL-0454 and Gull Wing Surface Mount Option Parts)
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
∆T = 115°C, 0.3°C/SEC
∆T = 100°C, 1.5°C/SEC
1
23
4
5
6
78
TIME – MINUTES
∆T = 145°C, 1°C/SEC
9 10 11 12
Note: Use of nonchlorine activated fluxes is highly recommended.
1-37