HMMC-1002 Datasheet, PDF (4/8 Pages) Agilent(Hewlett-Packard) – DC- 50 GHz Variable Attenuator

610
233
RF
IN
0
0
476 584
Notes:
1. All dimensions in microns and shown to center of bond pad.
2. DC_in, V1, DC_out, and V₂ bonding pads are 75 x 75 microns.
3. RF input and output bonding pads are 60 x 70 microns.
4. Chip thickness: 127 ± 15 µm.
Figure 2. HMMC-1002 Bonding Pad Locations.
887 994
2.0 mil
nom. gap
RF_IN
TC721A
RF_OUT
4 Wire Bonds using
0.7 mil dia. Gold Bond Wire
(Length NOT important)
DC_IN
V₁
DC_OUT
V₂
Figure 3. HMMC-1002 Assembly Diagram.
RF
233
OUT
1410
1470
7-15