HCPL-7560 Datasheet, PDF (4/18 Pages) Agilent(Hewlett-Packard) – Optically Isolated Sigma-Delta Modulator

Solder Reflow Temperature Profile
300
PREHEATING RATE 3˚C + 1˚C/-0.5˚C/SEC.
REFLOW HEATING RATE 2.5˚C ± 0.5˚C/SEC.
PEAK
TEMP.
245˚C
200
160˚C
150˚C
140˚C
100
2.5˚C ± 0.5˚C/SEC.
3˚C + 1˚C/-0.5˚C
PREHEATING TIME
150˚C, 90 + 30 SEC.
30
SEC.
30
SEC.
PEAK
TEMP.
240˚C
SOLDERING
TIME
200˚C
PEAK
TEMP.
230˚C
50 SEC.
ROOM
TEMPERATURE
0
0
TIGHT
TYPICAL
LOOSE
50
100
150
200
250
TIME (SECONDS)
Recommended Pb-Free IR Profile
tp
T_p
T_L
T_smax
T_smin
217˚C
150 - 200
260 +0/-5˚C
RAMP-UP
3˚C/SEC. MAX.
˚C
t_s
t_L
PREHEAT
60 to 180 SEC.
TIME WITHIN 5˚C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
RAMP-DOWN
6˚C/SEC. MAX.
60 to 150 SEC.
25
t 25˚C to PEAK
TIME (SECONDS)
NOTES:
THE TIME FROM 25 C to PEAK TEMPERATURE = 8 MINUTES MAX.
Tsmax = 200˚C, Tsmin = 150˚C
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