HCPL-553X Datasheet, PDF (4/14 Pages) Agilent(Hewlett-Packard) – Hermetically Sealed, Transistor Output Optocouplers for Analog and Digital Applications

8 Pin Ceramic DIP Single Channel Schematic
2 ^IF
ANODE
+
V_F
-
CATHODE
3
I_{CC 8}
V _CC
I_{B 7}
V_B
I_{O 6}
V_O
Note, base is pin 7.
5
GND
Functional Diagrams
16 Pin DIP
Through Hole
2 Channels
8 Pin DIP
Through Hole
1 Channel
8 Pin DIP
Through Hole
2 Channels
1
V _B1 16
1
2
V _CC1 15
2
3
V _O1 14
3
4
GND 13
4
5
V _B2 12
6
V _CC2 11
7
GND 10
8
V _O2 9
V _CC
8
1
V_B
7
2
V _OUT
6
3
5
4
GND
V _CC
8
V _O1
7
V _O2
6
5
GND
16 Pin Flat Pack
Unformed Leads
4 Channels
20 Pad LCCC
Surface Mount
2 Channels
15 14
1
16
V _CC2 V _B2
2
V _CC 15
19
V _O2 ¹³
20
GND 2 ¹²
3
V _O1 14
2
V _O1 ^{V CC1} 10
4
V _O2 13
3
V B1 ⁹
GND 1
5
V _O3 12
78
6
V _O4 11
7
GND 10
8
9
Note: 8 pin DIP and flat pack devices have common V_CC and ground. 16 pin DIP and LCCC (leadless ceramic chip carrier) packages have isolated
channels with separate V_CC and ground connections.
Outline Drawings
16 Pin DIP Through Hole, 2 Channels
0.89 (0.035)
1.65 (0.065)
20.06 (0.790)
20.83 (0.820)
8.13 (0.320)
MAX.
4.45 (0.175)
MAX.
0.51 (0.020)
MIN.
3.81 (0.150)
MIN.
0.20 (0.008)
0.33 (0.013)
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
4