HCNR200 Datasheet, PDF (3/16 Pages) Agilent(Hewlett-Packard) – High-Linearity Analog Optocouplers

Gull Wing Surface Mount Option #300
11.15 ± 0.15
(0.442 ± 0.006)
8
7
6
5
1
2
3
4
PAD LOCATION (FOR REFERENCE ONLY)
9.00 ± 0.15
(0.354 ± 0.006)
(06.2.1452)TYP.
12.30 ± 0.30
(0.484 ± 0.012)
1.55
(0.061)
MAX.
(04..10508)MAX.
1.3
(0.051)
0.9
(0.035)
12.30 ± 0.30
(0.484 ± 0.012)
11.00 _MAX.
(0.433)
1.78 ± 0.15
(0.070 ± 0.006)
2.54
(0.100)
BSC
0.75 ± 0.25
(0.030 ± 0.010)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
1.00 ± 0.15
(0.039 ± 0.006)
Maximum Solder Reflow Thermal Profile
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
∆T = 115°C, 0.3°C/SEC
∆T = 100°C, 1.5°C/SEC
1
23
4
5
6
7
8
TIME – MINUTES
∆T = 145°C, 1°C/SEC
9 10 11 12
(NOTE: USE OF NON-CHLORINE ACTIVATED FLUXES IS RECOMMENDED.)
+ 0.076
0.254 _{- 0.0051}
(0.010+-
0.003)
0.002)
7° NOM.
Regulatory Information
UL
Recognized under UL
BSI Certification according
The HCNR200/201 optocoupler
1577, Component
to BS415:1994;
features a 0.400" wide, eight pin
Recognition Program,
(BS EN60065:1994);
DIP package. This package was
FILE E55361
BS EN60950:1992
specifically designed to meet
worldwide regulatory require-
ments. The HCNR200/201 has
CSA Approved under CSA
Component Acceptance
Notice #5, File CA
(BS7002:1992) and
EN41003:1993 for Class
II applications
been approved by the following
88324
VDE Approved according to
organizations:
VDE 0884/06.92
(Available Option #050
only)
1-420