HCPL270L Datasheet, PDF (2/12 Pages) Agilent(Hewlett-Packard) – Low Input Current High Gain LVTTL/LVCMOS Compatible 3.3 V Optocouplers

The HCPL-070L and HCPL-073L
are surface mount devices
packaged in an industry standard
SOIC-8 footprint.
The SOIC-8 does not require
"through holes" in a PCB. This
package occupies approximately
one-third the footprint area of the
standard dual-in-line package.
The lead profile is designed to be
compatible with standard surface
mount processes.
Ordering Information
Specify Part Number followed by Option Number (if desired).
Example:
HCPL-270L #XXX
060 = VDE 0884 V_IORM = 630 V_peak Option
500 = Tape and Reel Packaging Option
Option data sheets available. Contact your Agilent sales representative
or authorized distributor for information.
Selection Guide
8-Pin DIP (300 Mil)
Single Channel
Package HCPL-
Dual Channel
Package HCPL-
270L
273L
Small Outline SO-8
Single Channel
Package HCPL-
Dual Channel
Package HCPL-
070L
073L
Minimum Input
ON Current (I_F)
0.5 mA
1.6 mA
Minimum CTR
400%
300%
Schematic
2 ^IF
ANODE
+
V_F
–
CATHODE
3
SHIELD
HCPL-270L/HCPL-070L
V_CC
8
I_CC
I_B
7
VB
1 ^IF1
+
V_F1
–
2
I_CC
V_CC
8
I_O1
V_O1
7
I_{O 6}
V_O
5
GND
3 ^IF2
–
V_F2
+
4
I_O2
V_O2
6
SHIELD
GND
5
USE OF A 0.1 µF BYPASS CAPACITOR CONNECTED
BETWEEN PINS 5 AND 8 IS RECOMMENDED
HCPL-273L/HCPL-073L
2