AMMC-5618 Datasheet, PDF (1/8 Pages) Agilent(Hewlett-Packard) – 6 - 20 GHz Amplifier

Agilent AMMC-5618
6 - 20 GHz Amplifier
Data Sheet
Chip Size:
920 x 920 µm (36.2 x 36.2 mils)
Chip Size Tolerance:± 10µm (± 0.4 mils)
Chip Thickness: 100 ± 10µm (4 ± 0.4 mils)
Pad Dimensions: 80 x 80 µm (3.1 x 3.1 mils or larger)
Description
Agilent’s AMMC- 5618 6−20 GHz
MMIC is an efficient two- stage
amplifier designed to be used as
a cascadable intermediate gain
block for EW applications. In
communication systems, it can
be used as a LO buffer, or as a
transmit driver amplifier. It is
fabricated using a PHEMT
integrated circuit structure that
provides exceptional efficiency
and flat gain performance.
During typical operation with a
single 5- V supply, each gain
stage is biased for Class- A
operation for optimal power
output with minimal distortion.
The RF input and output have
matching circuitry for use in
50- Ω environments. The
backside of the chip is both RF
and DC ground. This helps
simplify the assembly process
and reduces assembly related
performance variations and
costs. The MMIC is a cost
effective alternative to hybrid
(discrete FET) amplifiers that
require complex tuning and
assembly processes.
Features
• Frequency Range: 6 − 20 GHz
• High Gain: 14.5 dB Typical
• Output Power: 19.5 dBm Typical
• Input and Output Return Loss: < -12
dB
• Flat Gain Response: ± 0.3 dB Typical
• Single Supply Bias: 5 V @ 107 mA
Applications
• Driver/Buffer in microwave
communication systems
• Cascadable gain stage for EW
systems
• Phased array radar and transmit
amplifiers
AMMC-5618 Absolute Maximum Ratings ^[1]
Symbol Parameters/Conditions
Units Min. Max.
V_D1,V_D2 Drain Supply Voltage
V
7
V_G1
Optional Gate Voltage
V
-5
+1
V_G2
Optional Gate Voltage
V
-5
+1
I_D1
Drain Supply Current
mA
70
I_D2
Drain Supply Current
mA
84
P_in
RF Input Power
dBm
20
T_ch
Channel Temp.
°C
+150
T_b
Operating Backside Temp.
°C
-55
T_stg
Storage Temp.
°C
-65 +165
T_max
Maximum Assembly Temp. (60 sec max) °C
+300
Note:
1. Operation in excess of any one of these conditions may result in permanent damage to this device.
Note: These devices are ESD sensitive. The following precautions are strongly recommended:
Ensure that an ESD approved carrier is used when dice are transported from one destination to another.
Personal grounding is to be worn at all times when handling these devices.