HMC6343 Datasheet, PDF (5/13 Pages) Honeywell Solid State Electronics Center – 3-Axis Digital Compass Module

HMC6343
PACKAGE OUTLINES
PACKAGE DRAWING HMC6343 (32-PIN LPCC, dimensions in millimeters)
E1
e
0.10±0.08
0.34±0.03
D1
D
0.57±0.03
Pin 1
E
Bottom View
Dimensions (mm)
A (height)
D
D1
E
E1
e
Minimum
1.73
-
-
-
-
-
Nominal
1.87
9.00 BSC
6.40 BSC
9.00 BSC
6.40 BSC
0.8 Basic
Maximum
2.02
-
-
-
-
-
MOUNTING CONSIDERATIONS
The following is the recommend printed circuit board (PCB) footprint for the HMC6343. All dimensions are nominal and in
millimeters.
Stencil Design and Solder Paste
A 4 mil stencil and 100% paste coverage is recommended for the electrical contact pads. The HMC6343 has been tested
successfully with no-clean solder paste.
Pick and Place
Placement is machine dependant and no restrictions are recommended, and have be tested with mechanical centering.
Placement force should be equivalent 1206 SMT resistors and enough force should be used to squeeze the paste out
from the package/contact pad overlap and to keep the package pin contacts vertical.
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