HMC5843 Datasheet, PDF (4/19 Pages) Honeywell Solid State Electronics Center – 3-Axis Digital Compass IC

HMC5843
PACKAGE OUTLINES
PACKAGE DRAWING HMC5843 (20-PIN LPCC, dimensions in millimeters)
D2
A
Pin 1
D3
Sym Min Nom Max
A
1.20
-
1.46
D
4.0 BSC
E2
E
D2
2.25
D3
0.25 x 20 pins
E
4.0 BSC
E2
2.25
L
e
D
e
0.50 Basic
L
0.40 x 20 pins
HMC5843 – bottom view
MOUNTING CONSIDERATIONS
The following is the recommend printed circuit board (PCB) footprint for the HMC5843.
PCB Pad Definition and Traces
The HMC5843 is a fine pitch LCC package with a 0.50mm pin pitch (spacing), with the pin pads defined as 0.40mm by
0.25mm in size. PCB pads are recommended to be oversized by 0.025mm from each pad for a short dimension oversize
of 0.05mm. The interior PCB pad is recommended to be 0.05mm oversized per pin with an exterior oversize of 0.20mm
for proper package centering and to permit test probing. Size the traces between the HMC5843 and the external
capacitors (C1 and C2) to handle the 1 ampere peak current pulses with low voltage drop on the traces.
Stencil Design and Solder Paste
A 4 mil stencil and 100% paste coverage is recommended for the electrical contact pads.
Pick and Place
Placement is machine dependant and no restrictions are recommended, and have been tested with mechanical centering.
Placement force should be equivalent 1206 SMT resistors and enough force should be used to squeeze the paste out
from the package/contact pad overlap and to keep the package pin contacts vertical.
Reflow and Rework
No special profile is required for the HMC5843 and compatible with lead eutectic and lead-free solder paste reflow
profiles. Honeywell recommends the adherence to solder paste manufacturer’s guidelines. The HMC5843 may be
reworked with soldering irons, but extreme care must be taken not to overheat the copper pads from the part’s fiberglass
substrate. Irons with a tip temperature no greater than 315°C should be used. Excessive rework risks the copper pads
pulling away into the molten solder.
4
www.honeywell.com