HMC741ST89E Datasheet, PDF (8/8 Pages) Hittite Microwave Corporation – InGaP HBT ACTIVE BIAS MMIC AMPLIFIER, 0.05 - 3 GHz

Evaluation PCB
v00.0209
HMC741ST89E
InGaP HBT ACTIVE BIAS
MMIC AMPLIFIER, 0.05 – 3 GHz
9
List of Materials for Evaluation PCB 124390 ^[1]
Item
J1, J2
J3, J4
C1, C2
C3
C4
C5
L1
U1
PCB ^[2]
Description
PCB Mount SMA Connector
DC Pin
470 pF Capacitor, 0402 Pkg.
100 pF Capacitor, 0402 Pkg.
1000 pF Capacitor, 0603 Pkg.
2.2 μF Capacitor Tantalum
820 nH Inductor, 0603 Pkg.
HMC741ST89E
119392 Evaluation PCB
The circuit board used in the final application
should use RF circuit design techniques. Signal
lines should have 50 ohm impedance while the
package ground leads and package bottom should
be connected directly to the ground plane similar to
that shown. A sufficient number of via holes should
be used to connect the top and bottom ground
planes. The evaluation board should be mounted
to an appropriate heat sink. The evaluation circuit
board shown is available from Hittite upon request.
[1] Reference this number when ordering complete evaluation PCB
[2] Circuit Board Material: FR4
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
Order On-line at www.hittite.com
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