HMC670LC3C Datasheet, PDF (7/8 Pages) Hittite Microwave Corporation – 13 Gbps, 1:2 Fanout Buffer

Evaluation PCB
7
v02.1209
HMC670LC3C
13 Gbps, 1:2 Fanout Buffer
Item
J1
J2
J3
J4
J5
J6
J7, J8, J12 - J14
J10
J11
Description
DO1P
DO1N
DINP
DINN
DO2N
DO2P
GND
VR
Vee
List of Materials for Evaluation PCB 118777 ^[1]
Item
J1 - J6
Description
PCB Mount SMA RF Connectors
The circuit board used in the application should use
RF circuit design techniques. Signal lines should
J7 - J14
DC Pin
have 50 Ohm impedance while the package gro-
C1 - C3
100 pF Capacitor, 0402 pkg
und leads should be connected directly to the
C4 - C5
4.7 μF Capacitor, Tantalum
ground plane similar to that shown. The exposed
R1
10 Ohm Resistor, 0603 Pkg.
packaged base should be connected to Vee. A
U1
HMC670LC3C
High Speed Logic, Fanout Buffer
PCB ^[2]
118775 Evaluation Board
[1] Reference this number when ordering complete evaluation PCB
[2] Circuit Board Material: Rogers 4350
sufficient number of via holes should be used to
connect the top and bottom ground planes. The
evaluation circuit board shown is available from Hit-
tite upon request.
7-8
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
Order On-line at www.hittite.com