HMC670LC3C Datasheet, PDF (5/8 Pages) Hittite Microwave Corporation – 13 Gbps, 1:2 Fanout Buffer

v02.1209
7
Absolute Maximum Ratings
Power Supply Voltage (Vee)
Input Signals
Output Signals
Storage Temperature
Operating Temperature
-3.75V to +0.5V
-2V to +0.5V
-1.5V to +1V
-65°C to +150°C
-40°C to +85°C
Outline Drawing
HMC670LC3C
13 Gbps, 1:2 Fanout Buffer
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
7-6
NOTES:
1. PACKAGE BODY MATERIAL: ALUMINA
2. LEAD AND GROUND PADDLE PLATING:
30-80 MICROINCHES GOLD OVER 50 MICROINCHES MINIMUM NICKEL.
3. DIMENSIONS ARE IN INCHES [MILLIMETERS].
4. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm DATUM -C-
6. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.
7. GROUND PADDLE MUST BE SOLDERED TO Vee.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
Order On-line at www.hittite.com