HMC461LP3_06 Datasheet, PDF (7/8 Pages) Hittite Microwave Corporation – InGaP HBT 1 Watt High IP3 AMPLIFIER, 1.7 - 2.2 GHz

5
Evaluation PCB
v02.0705
HMC461LP3 / 461LP3E
InGaP HBT 1 Watt High IP3
AMPLIFIER, 1.7 - 2.2 GHz
J3, J4
Pin Number
1, 2, 3
4, 5, 6
Description
GND
Vs
5 - 376
List of Materials for Evaluation PCB 106485 ^[1]
Item
J1, J2
J3, J4
C1, C2
C3, C4
C5, C6
C7, C8
C9, C10
L1, L2
U1
Description
PCB Mount SMA Connector
2 mm DC Header
2.2 μF Capacitor, Tantalum
100 pF Capacitor, 0402 Pkg.
5 pF Capacitor, 0402 Pkg.
0.8 pF Capacitor, 0402 Pkg.
4 pF Capacitor, 0402 Pkg.
8.2 nH Inductor, 0402 Pkg.
HMC461LP3 / HMC461LP3E
Power Amplifier
The circuit board used in the final application
should use RF circuit design techniques. Signal
lines should have 50 ohm impedance while the
package ground leads and exposed paddle should
be connected directly to the ground plane similar to
that shown. A sufficient number of VIA holes should
be used to connect the top and bottom ground
planes. The evaluation board should be mounted
to an appropriate heat sink. The evaluation circuit
board shown is available from Hittite upon request.
U2, U3
PCB ^[2]
Panasonic Balun, P/N EHFFD - 1619
106483 Evaluation PCB, 10 mils
[1] Reference this number when ordering complete evaluation PCB
[2] Circuit Board Material: Rogers 4350, Er = 3.48
Specifications and data reflect HMC461LP3 measured with external baluns in a balanced
amplifier configuration optimized for 1.85 - 2.2 GHz per application circuit herein.
Contact HMC Applications for 1.7 - 1.85 GHz performance optimization.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
Order On-line at www.hittite.com