HMC461LP3_06 Datasheet, PDF (5/8 Pages) Hittite Microwave Corporation – InGaP HBT 1 Watt High IP3 AMPLIFIER, 1.7 - 2.2 GHz

5
Outline Drawing
v02.0705
HMC461LP3 / 461LP3E
InGaP HBT 1 Watt High IP3
AMPLIFIER, 1.7 - 2.2 GHz
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE
SOLDERED TO PCB RF GROUND.
7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED
LAND PATTERN.
5 - 374
Package Information
Part Number
HMC461LP3
Package Body Material
Low Stress Injection Molded Plastic
Lead Finish
Sn/Pb Solder
HMC461LP3E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
MSL Rating
MSL1 ^[1]
MSL1 ^[2]
Package Marking ^[3]
461
XXXX
461
XXXX
Specifications and data reflect HMC461LP3 measured with external baluns in a balanced
amplifier configuration optimized for 1.85 - 2.2 GHz per application circuit herein.
Contact HMC Applications for 1.7 - 1.85 GHz performance optimization.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
Order On-line at www.hittite.com