HMC461LP3 Datasheet, PDF (7/8 Pages) Hittite Microwave Corporation – InGaP HBT 1 Watt High IP3 AMPLIFIER, 1.7 - 2.2 GHz

v01.0604
MICROWAVE CORPORATION
8
Evaluation PCB
HMC461LP3
InGaP HBT 1 Watt High IP3
AMPLIFIER, 1.7 - 2.2 GHz
List of Materials
Item
Description
J1, J2
PC Mount SMA Connector
J3, J4
2 mm DC Header
C1, C2
2.2 µF Capacitor, Tantalum
C3, C4
100 pF Capacitor, 0402 Pkg.
C5, C6
5 pF Capacitor, 0402 Pkg.
C7, C8
0.8 pF Capacitor, 0402 Pkg.
C9, C10
4 pF Capacitor, 0402 Pkg.
L1, L2
8.2 nH Inductor, 0402 Pkg.
U1
HMC461LP3 Power Amplifier
U2, U3
Panasonic Balun, P/N EHFFD - 1619
PCB*
106483 Evaluation PCB, 10 mils
* Circuit Board Material: Rogers 4350, Er = 3.48
J3, J4
Pin Number
1, 2, 3
4, 5, 6
Description
GND
Vs
The circuit board used in the final application should use
RF circuit design techniques. Signal lines should have
50 ohm impedance while the package ground leads
and exposed paddle should be connected directly to the
ground plane similar to that shown. A sufficient number
of VIA holes should be used to connect the top and
bottom ground planes. The evaluation board should be
mounted to an appropriate heat sink. The evaluation cir-
cuit board shown is available from Hittite upon request.
8 - 278
Specifications and data reflect HMC461LP3 measured with external baluns in a balanced
amplifier configuration optimized for 1.85 - 2.2 GHz per application circuit herein.
Contact HMC Applications for 1.7 - 1.85 GHz performance optimization.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
Order Online at www.hittite.com