HMC457QS16G Datasheet, PDF (7/10 Pages) Hittite Microwave Corporation – InGaP HBT 1 WATT POWER AMPLIFIER, 1.7 - 2.2 GHz

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Outline Drawing
HMC457QS16G
InGaP HBT 1 WATT POWER
AMPLIFIER, 1.7 - 2.2 GHz
NOTES:
1. PACKAGE BODY MATERIAL: MOLDING COMPOUND MP-180S
OR EQUIVALENT.
2. LEAD MATERIAL: Cu w/Ag SPOT PLATING.
3. LEAD PLATING: 80Sn/20Pb
4. DIMENSIONS ARE IN INCHES [MILLIMETERS].
5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.
6. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.
7. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.
8. CLASSIFIED AS MOISTURE SENSITIVITY LEVEL (MSL) 1.
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