HMC414MS8G_09 Datasheet, PDF (7/8 Pages) Hittite Microwave Corporation – GaAs InGaP HBT MMIC POWER AMPLIFIER, 2.2 - 2.8 GHz

Evaluation PCB
v04.0607
HMC414MS8G / 414MS8GE
GaAs InGaP HBT MMIC
POWER AMPLIFIER, 2.2 - 2.8 GHz
11
* For 5V operation on Vctl line,
select R1, R2 such that 3.6V is
presented on Pins 6 and 8.
List of Materials for Evaluation PCB 105006 ^[1]
Item
J1 - J2
J3
C1
C2
C3 - C6
C7
L1
U1
Description
PCB Mount SMA RF Connector
2 mm DC Header
2.7 pF Capacitor, 0603 Pkg.
100 pF Capacitor, 0402 Pkg.
330 pF Capacitor, 0603 Pkg.
2.2 μF Capacitor, Tantalum
18nH Inductor 0603 Pkg.
HMC414MS8G / HMC414MS8GE
Amplifier
The circuit board used in the final application should
use RF circuit design techniques. Signal lines
should have 50 ohm impedance while the package
ground leads and exposed paddle should be con-
nected directly to the ground plane similar to that
shown. A sufficient number of via holes should be
used to connect the top and bottom ground planes.
The evaluation board should be mounted to an
appropriate heat sink. The evaluation circuit board
shown is available from Hittite upon request.
PCB ^[2]
105074 Eval Board
[1] Reference this number when ordering complete evaluation PCB
[2] Circuit Board Material: Rogers 4350
11 - 64
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
Order On-line at www.hittite.com