HMC413QS16G Datasheet, PDF (7/8 Pages) Hittite Microwave Corporation – GaAs InGaP HBT MMIC POWER AMPLIFIER, 1.6 - 2.2 GHz

v03.1203
MICROWAVE CORPORATION
HMC413QS16G
GaAs InGaP HBT MMIC
POWER AMPLIFIER, 1.6 - 2.2 GHz
8
Evaluation PCB
* For 5V operation on Vctl line,
select R1, R2 such that 3.6V is
presented on Pins 3 and 14.
List of Material
Item
Description
J1 - J2
PC Mount SMA RF Connector
J3
2 mm DC Header
C1
2.2 pF Capacitor, 0603 Pkg.
C2
10 pF Capacitor, 0402 Pkg.
C3 - C4
330 pF Capacitor, 0603 Pkg.
C5
2.2 µF Capacitor, Tantalum
L1
16 nH Inductor 0603 Pkg.
U1
HMC413QS16G Amplifier
PCB*
105018 Eval Board
* Circuit Board Material: Rogers 4350
The circuit board used in the final application should use
RF circuit design techniques. Signal lines should have
50 ohm impedance while the package ground leads
and exposed paddle should be connected directly to the
ground plane similar to that shown. A sufficient number
of VIA holes should be used to connect the top and
bottom ground planes. The evaluation board should be
mounted to an appropriate heat sink. The evaluation cir-
cuit board shown is available from Hittite upon request.
8 - 172
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