HMC683LP6C Datasheet, PDF (6/10 Pages) Hittite Microwave Corporation – HIGH IP3 DUAL CHANNEL DOWNCONVERTER w/ LO SWITCH, 0.7 - 1.0 GHz

Outline Drawing
HMC683LP6C / 683LP6CE
v02.0808
HIGH IP3 DUAL CHANNEL
DOWNCONVERTER w/ LO SWITCH, 0.7 - 1.0 GHz
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NOTES:
1. PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED
PLASTIC SILICA AND SILICON IMPREGNATED.
2. LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY.
3. LEAD AND GROUND PADDLE PLATING: 100% MATTE TIN.
4. DIMENSIONS ARE IN INCHES [MILLIMETERS].
5. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
6. PAD BURR LENGTH SHALL BE 0.15mm MAX.
PAD BURR HEIGHT SHALL BE 0.25mm MAX.
7. PACKAGE WARP SHALL NOT EXCEED 0.05mm
8. ALL GROUND LEADS AND GROUND PADDLE
MUST BE SOLDERED TO PCB RF GROUND.
9. REFER TO HITTITE APPLICATION NOTE
FOR SUGGESTED PCB LAND PATTERN.
Package Information
Part Number
Package Body Material
HMC683LP6C
Low Stress Injection Molded Plastic
Lead Finish
Sn/Pb Solder
HMC683LP6CE RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
MSL Rating
MSL1 ^[1]
MSL1 ^[2]
Package Marking ^[3]
H683
XXXX
H683
XXXX
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824
Phone: [phone] Fax: [phone] Order On-line at www.hittite.com
Application Support: Phone: [phone] or [e-mail]
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