HMC606LC5 Datasheet, PDF (6/6 Pages) Hittite Microwave Corporation – GaAs InGaP HBT MMIC ULTRA LOW PHASE NOISE, DISTRIBUTED AMPLIFIER, 2 - 18 GHz

HMC606LC5
v00.0407
GaAs InGaP HBT MMIC ULTRA LOW
PHASE NOISE, DISTRIBUTED AMPLIFIER, 2 - 18 GHz
5
Evaluation PCB
List of Materials for Evaluation PCB 117156 ^[1]
Item
Description
J1 - J2
SRI K Connector
J3 - J4
2mm Molex Header
C1, C2
4.7 μF Capacitor, Tantalum
C3, C4
100 pF Capacitor, 0402 Pkg.
C5, C6
1000 pF Capacitor, 0603 Pkg.
U1
HMC465LP5 / HMC465LP5E
PCB ^[2]
117325 Evaluation PCB
[1] Reference this number when ordering complete evaluation PCB
[2] Circuit Board Material: Rogers 4350
The circuit board used in the final application
should use RF circuit design techniques. Signal
lines should have 50 ohm impedance while the
package ground leads and package bottom should
be connected directly to the ground plane similar to
that shown. A sufficient number of via holes should
be used to connect the top and bottom ground
planes. The evaluation board should be mounted
to an appropriate heat sink. The evaluation circuit
board shown is available from Hittite upon request.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
Order On-line at www.hittite.com
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