HMC684LP4 Datasheet, PDF (5/8 Pages) Hittite Microwave Corporation – BiCMOS MMIC MIXER W/ INTEGRATED BiCMOS MMIC MIXER W/ INTEGRATED

Outline Drawing
8
v01.0408
HMC684LP4 / 684LP4E
BiCMOS MMIC MIXER W/ INTEGRATED
LO AMPLIFIER, 700 - 1000 MHz
Package Information
Part Number
Package Body Material
HMC684LP4
Low Stress Injection Molded Plastic
HMC684LP4E RoHS-compliant Low Stress Injection Molded Plastic
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
NOTES:
1. PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED
PLASTIC SILICA AND SILICON IMPREGNATED.
2. LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY.
3. LEAD AND GROUND PADDLE PLATING: 100% MATTE TIN.
4. DIMENSIONS ARE IN INCHES [MILLIMETERS].
5. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
6. PAD BURR LENGTH SHALL BE 0.15mm MAX.
PAD BURR HEIGHT SHALL BE 0.25mm MAX.
7. PACKAGE WARP SHALL NOT EXCEED 0.05mm
8. ALL GROUND LEADS AND GROUND PADDLE
MUST BE SOLDERED TO PCB RF GROUND.
9. REFER TO HITTITE APPLICATION NOTE
FOR SUGGESTED PCB LAND PATTERN.
Lead Finish
Sn/Pb Solder
100% matte Sn
MSL Rating
MSL1 ^[1]
MSL1 ^[2]
Package Marking ^[3]
H684
XXXX
H684
XXXX
8 - 238
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
Order On-line at www.hittite.com