HMC494LP3 Datasheet, PDF (5/6 Pages) Hittite Microwave Corporation – SMT GaAs HBT MMIC DIVIDE-BY-8, DC - 18 GHz

v01.0604
MICROWAVE CORPORATION
Evaluation PCB
10
HMC494LP3
SMT GaAs HBT MMIC
DIVIDE-BY-8, DC - 18 GHz
List of Materials
Item
Description
J1 - J3
PC Mount SMA RF Connector
J4, J5
DC Pin
C2 - C5
100 pF Capacitor, 0402 Pkg.
C6
1000 pF Capacitor, 0603 Pkg.
C1
2.2 uF Tantalum Capacitor
U1
HMC492LP3 Divide-by-2
PCB*
107197 Eval Board
* Circuit Board Material: Rogers 4350
The circuit board used in the final application should use
RF circuit design techniques. Signal lines should have
50 ohm impedance while the package ground leads
and backside ground slug should be connected directly
to the ground plane similar to that shown. A sufficient
number of via holes should be used to connect the top
and bottom ground planes. The evaluation circuit board
shown is available from Hittite upon request. This evalu-
ation board is designed for single ended input testing. J2
and J3 provide differential output signals.
10 - 134
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