HMC494LP3 Datasheet, PDF (3/6 Pages) Hittite Microwave Corporation – SMT GaAs HBT MMIC DIVIDE-BY-8, DC - 18 GHz

v01.0604
MICROWAVE CORPORATION
10
Output Voltage Waveform,
Pin= 0 dBm, Fout= 882 MHz, T= 25 °C
500
400
300
200
100
0
-100
-200
-300
-400
-500
22.7 22.9 23.1 23.3 23.5 23.7 23.9 24.1 24.3 24.5 24.7
TIME (nS)
Outline Drawing
HMC494LP3
SMT GaAs HBT MMIC
DIVIDE-BY-8, DC - 18 GHz
Absolute Maximum Ratings
RF Input (Vcc = +5V)
+13 dBm
Supply Voltage (Vcc1, Vcc2)
+5.5V
Channel Temperature (Tc)
135 °C
Continuous Pdiss (T = 85 °C)
593 mW
(derate 11.9 mW/° C above 85 °C)
Thermal Resistance (R_TH)
(junction to ground paddle)
84 °C/W
Storage Temperature
-65 to +150 °C
Operating Temperature
-40 to +85 °C
Typical Supply Current vs. Vcc
Vcc1, Vcc2 (V)
Icc (mA)
4.75
90
5.0
103
5.25
115
Note: Divider will operate over full voltage range shown above
10 - 132
NOTES:
1. MATERIAL PACKAGE BODY: LOW STRESS INJECTION MOLDED
PLASTIC SILICA AND SILICON IMPREGNATED.
2. LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY
3. LEAD AND GROUND PADDLE PLATING: Sn/Pb SOLDER
4. DIMENSIONS ARE IN INCHES [MILLIMETERS].
5. LEAD SPACING TOLERANCE IS NON-CUMULATIVE
6. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
7. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
8. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED
TO PCB RF GROUND.
9. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED PCB
LAND PATTERN.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
Order Online at www.hittite.com