HMC424 Datasheet, PDF (5/6 Pages) Hittite Microwave Corporation – 0.5dB LSB GaAs MMIC 6-BIT DIGITAL ATTENUATOR, DC - 13 GHz

MICROWAVE CORPORATION
v02.0404
HMC424
0.5dB LSB GaAs MMIC 6-BIT DIGITAL
ATTENUATOR, DC - 13 GHz
Suggested Driver Circuit (One Circuit Required Per Bit Control Input)
2
Simple driver using inexpensive standard logic ICs provides fast switching using minimum DC current.
* Recommended value to suppress unwanted RF signals at V1 - V6 control lines.
Assembly Diagram
2 - 12
Mounting & Bonding Techniques for Millimeterwave GaAs MMICs
The die should be attached directly to the ground plane eutectically or with conductive epoxy (see HMC general Handling,
Mounting, Bonding Note).
50 Ohm Microstrip transmission lines on 0.127mm (5 mil) thick alumina thin film substrates are recommended for bringing RF
to and from the chip (Figure 1). If 0.254mm (10 mil) thick alumina thin film substrates must be used, the die should be raised
0.150mm (6 mils) so that the surface of the die is coplanar with the surface of the substrate. One way to accomplish this is to
attach the 0.102mm (4 mil) thick die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached
to the ground plane (Figure 2).
Microstrip substrates should be brought as close to the die as possible in order to minimize bond wire length. Typical die-to-
substrate spacing is 0.076mm to 0.152 mm (3 to 6 mils).
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