HMC424 Datasheet, PDF (4/6 Pages) Hittite Microwave Corporation – 0.5dB LSB GaAs MMIC 6-BIT DIGITAL ATTENUATOR, DC - 13 GHz

MICROWAVE CORPORATION
v02.0404
HMC424
0.5dB LSB GaAs MMIC 6-BIT DIGITAL
ATTENUATOR, DC - 13 GHz
Outline Drawing
2
Pad Descriptions
1. ALL DIMENSIONS ARE IN INCHES (MILLIMETERS).
2. TYPICAL BOND PAD IS .004” SQUARE.
3. TYPICAL BOND PAD SPACING IS .006” CENTER TO CENTER EXCEPT AS NOTED.
4. BACKSIDE METALIZATION: GOLD
5. BACKSIDE METAL IS GROUND
6. BOND PAD METALIZATION: GOLD
Pad Number
Function
Description
Interface Schematic
GND
Die bottom must be connected to RF ground.
1, 3
RF1, RF2
This pad is DC coupled and matched to 50 Ohm. Blocking capaci-
tors are required if RF line potential is not equal to 0V.
2
VEE
Supply Voltage -5V ± 10%
4, 5, 6, 7, 8, 9
V1 - V6
See truth table and control voltage table.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
Order Online at www.hittite.com
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