HMC-XTB110 Datasheet, PDF (3/4 Pages) Hittite Microwave Corporation – GaAs MMIC PASSIVE x3 FREQUENCY MULTIPLIER, 24 - 30 GHz INPUT

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HMC-XTB110
GaAs MMIC PASSIVE x3 FREQUENCY
MULTIPLIER, 24 - 30 GHz INPUT
Pad Descriptions
Pad Number
Function
2
1
RFIN
2
RFOUT
Description
This pad is DC coupled and matched to 50 Ohms.
This pad is DC coupled and matched to 50 Ohms.
Interface Schematic
Die Bottom
GND
Die bottom must be connected to RF/DC ground.
Outline Drawing
2 - 78
Die Packaging Information ^[1]
Standard
Alternate
WP-2 (Waffle Pack)
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM].
2. BACKSIDE METALLIZATION: GOLD.
3. BACKSIDE METAL IS GROUND.
4. BOND PAD METALLIZATION: GOLD.
5. CONNECTION NOT REQUIRED FOR
UNLABELED BOND PADS.
6. OVERALL DIE SIZE ^{±.002”}
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
Order On-line at www.hittite.com